The manual surface mounting area is used to mount printed circuit boards using Fritsch stencil printers and manipulators.

FSE RD-5020 semi-automatic rework station is operated to place components into packages with leads located under the package, such as BGA, QFN, PQFP, etc. The chips can be installed and replaced in these packages with a pitch starting from 0.5 mm.

This rework station is distinguished by the use of three heaters, i.e., two air heaters with independent adjustment and an infrared heater that is intended to gradually heat a circuit board from below and prevent the printed circuit board under rework from deforming during the heating cycle. The capabilities of this station make it possible to adjust the thermal profile and configure it to a specific type of chip or printed circuit board.

Printed circuit boards with manually installed components are soldered using conveyor-type convection reflow ovens incorporated in our automated mounting lines.

Our production site is equipped with four powerful surface mount lines based on Assembleon and Samsung (Hanwha) machines.

The total output of these lines is 300,000 components per hour.

Our equipment features quick changeover so we can switch to another product within the shortest period of time and handle batches ranging from 10–20 pieces to tens and hundreds of thousands of items.

Before being put into production, all products are subject to engineering preparations, i.e., development of process documentation and manufacturing of custom tooling.

We strive to purchase parts by our own as only in this case we will be able to guarantee the highest quality of products or assembly units for our partners. This also eliminates the need to troubleshoot or dismantle defective electronic parts that otherwise would inevitably lead to a longer production time and higher cost of the finished product.

Our long-term partnership with leading manufacturers in Europe and the Asia-Pacific region allows us to supply the Customer with a wide range of electronic parts, thus enabling our partners to receive electronic components and finished devices at reasonable prices.

We will be happy to provide you with information about how work processes are organised in each production area.

Through-hole technology is used in manual and automated mounting areas of our enterprise that meet the requirements of the IEC 61340 standard for ESD protection.

Our manual through-hole mounting area is equipped with Weller and PACE professional soldering stations. We employ 10 highly qualified installers.

We have managed to automate the mass production process as follows:

• Leads are inserted into holes using the Universal 6241D machine
• Leads are soldered in a nitrogen environment using the Seho PowerSelective system.

Press-fit connections have a high level of reliability. Factors that may hinder circuit board soldering, such as large thickness, massive power planes, play a positive role here, i.e, the thicker the circuit board and the more metal it contains, the higher the press-fitting force, the larger the contact area, and as a result, the higher the connection reliability.

Our company has formed the necessary set of tools for pressing in all types of connectors to ensure high-quality press-fit mounting of electronic components.

Adhesive sealants are employed in electronics to secure components and structural elements and seal an electronic device. They can be effectively used in different conditions, including low and high temperatures, humidity and salt mist, vibrations and shocks, bacterial and fungal contamination, ultraviolet radiation, low and high pressure, presence of corrosive liquids and gases, etc.

The material application process is divided into two stages, i.e., application and curing (polymerisation). Digital dispensers are used at the adhesive application stage to ensure performance and repeatability of the process. During the curing stage, the electronic unit with the applied material is kept at a temperature of 160 °C for 5 minutes. Depending on the features of the electronic unit, the temperature exposure parameters can be changed. The use of special adhesives to ensure the mechanical strength of soldered joints of chip leads in BGA packages gives good results as evidenced by the successful experience of operating our customers' products in demanding environments.

ATB Electronics applies a waterproof coating to printed circuit boards and electronic units.

This coating can be applied by dipping, brushing, or spraying. If necessary, the sections of electronic components that do not require coating are protected with tape or a special compound before applying a waterproof coating.

The following types of coatings are used in our production process: UR231, Plastik 70, Humi Seal. Every class of polymers and corresponding coatings have inherent characteristics that determine the choice of a particular waterproof coating. PCB coating methods and materials are selected in accordance with the conditions specified in the Customer's terms of reference or individually agreed upon with the Customer.

Testing and adjustment for medium and large batches of products are an integral part of the production process.

Our specialists can either develop a new test fixture or use the fixtures and equipment furnished by the Customer.

We provide technical and engineering support throughout the entire life cycle of products manufactured at our production facility. For warranty cases, our production site has a repair area fitted with all the necessary measuring equipment.

We are confident that a preliminary analysis, a streamlined technological process, certified materials and parts used in production are key factors that determine the high quality of our products.

Our QC specialists control the release of products at each stage from project receipt to packaging the finished product and, if necessary, promptly adjust the technology and make changes to process charts.

Our QC specialists work in the following areas:

• Solder paste inspection. The main reason for surface mount defects is inadequate solder paste application. Our production lines are equipped with the Parmi HS-60 Automated 3D Solder Paste Optical Inspection System, allowing us to quickly change the settings of stencil printers and minimise the number of defective soldered joints on finished products.
• Quality control of surface mount soldering. Automated quality control of soldered joints is carried out using the in-line Mirtec MV-7XL system that allows us to perform a 3D soldering quality analysis and sort out conforming circuit boards from non-conforming ones.
• X-ray inspection FEINFOCUS COMET COUGAR X-Ray Inspection Machine is used to control the soldering quality of chips with leads located under the package.
• Visual inspection. Our production site has a visual inspection area equipped with four Mantis professional systems to manufacture prototypes.