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Production facilities

PRODUCTION FACILITIES

Surface mounting area

Line 1

It is designed for mounting circuit boards for a wide range of radio component packages, with chip components in small and medium volumes being prevalent.

characteristics

Output — up to 45,000 components per hour

PCB dimensions — min. 50 x 50, max 260 x 350 mm

Accuracy — 35 µm

Size of mountable components — 01005 (0402) to 30 mm

Max. component height — 6.5 mm

Line 2

This line is distinguished by versatility and quick changeover capabilities. It is used to mount small and medium batches of devices.

characteristics

Output — up to 45,000 components per hour

PCB dimensions — min. 50 х 50, max. 260 х 350 mm

Accuracy — 35 µm

Size of mountable components — 01005 (0402) to 30 mm

Max. component height — 6.5 mm

Line 3

It is characterised by high output, versatility, and a wide range of mountable electronic components, including mechanical gripping and mounting of elements up to 50 mm in height. It is used to produce medium and large batches of electronic components.

characteristics

Output — up to 120000 components per hour

PCB dimensions — min. 50 х 50, max. 400 х 460 mm

Accuracy — 35 µm (chip component) / 25 µm (QFP)

Size of mountable components — 01005 (0402) to 55 mm

Max. component height — 45 mm

line 4

It is characterised by high output. It provides for high-speed mounting of printed circuit boards of increased complexity. High-quality mounting is ensured through the use of modern equipment for solder paste control and optical inspection. The line is used to produce large batches.

characteristics

Output — up to 188000 components per hour

PCB dimensions — min. 50 х 50 mm, max. 400 х 460 mm

Accuracy — 30 µm (chip component) / 25 µm (QFP)

Size of mountable components — 01005 (0402) to 55 mm

Max. component height — 15 mm

Inspection

To ensure high-quality PCB mounting in accordance with the IPC-A-610 international standard, our production site is equipped with:

  1. Parmi S60L Automated Solder Paste Quality Control

  2. Mirtec MV-7Xi Automated Optical Inspection System

  3. FEINFOCUS COMET COUGAR X-Ray Inspection Machine

  4. Mantis Stereo Microscopes for visual inspection

Through hole mounting

Through-hole mounting automation

  1. SEHO Power Selective Nitrogen Soldering System

  2. Universal 6241D Automated Through-Hole Inserter

Manual mounting area

There are 30 workplaces for mounting operations at our production site.

Assembly area

The assembly area is equipped with three conveyor lines for continuous assembly of devices.

Testing area

This area is used to test new equipment.