differ in low cost and are widely used. A wide range of CEM-1, FR-2, FR-4 materials is available in THE production, as well as various colors of the protective solder mask and silkscreen marking. Various types of contact surface finishes are available - HASL, OST , Immersion gold (ENIG), Immersion silver.

modern electronics products require reducing not only the size of the Board topology elements, but also the size of the Board itself. We can produce boards up to 32 words with blind and blind holes

We use high-tech materials FR4 (both standard and high-temperature), Rogers 4000 series, AD series and polyimides, finishing coatings: HASL, Immersion gold (ENIG), Immersion silver. Gold - plated edge connectors.

our production facilities allow you to control the quality of each Board, on small series testing is carried out using the flying probe method, on large ones - by manufacturing equipment, and we can also measure the impedance values according to the customer's request.

we use materials such as PTFE polytetrafluoroethylene(Teflon), bicarbonate or ceramic laminates reinforced with glass fiber. These materials, due to the low value of the tangent of the dielectric loss angle, are mandatory for use in microwave boards.

our technologies allow us to produce multi-layer printed circuit boards using both standard materials such as FR-4 and microwave in a single PCB stack. After production, all high-frequency boards are tested for dynamic resistance with an accuracy of 5%, and the test data is entered in the test Protocol.

This is a great alternative to conventional circuit boards, if the product is exposed during operation to high mechanical stress, or require a high level of dimensional stability, or on-Board elements have strict requirements to the heat sink ( LEDs, power transistors I. t),

For our customers we offer one and two-sided PCB with aluminum base. Depending on the design, their thermal conductivity ranges from 0.67 to 2.2 W/m*K (the value for FR4 is approximately 0.3 W/m*K). We offer a wide range of solder mask colors and finish coatings.

Depending on the layout, flexible-rigid printed circuit boards can be manufactured according to the symmetric principle (with internal flexible layers) and asymmetric (with external flexible layers). Features of manufacture of these boards are particularly flexible element or the ability to break. I.e. the thickness of the flexible portion, to reduce the likelihood of fracture can be an additional coating with compound. There may also be additional sizing of the joint between the rigid and flexible element. The parameters of the production of printed circuit boards:

• thickness from 0.15 – 8 mm.
• Electrocontrol – flying probes and adapter
• different colors of mask and silkscreen
• Main types of coating: HAL, HASL and immersion gold.
• the rigid part is FR-4, FR Nidh Tg, etc., the flexible part is polyimide.

Flexible-rigid boards are widely used in modern devices, due to a number of undeniable advantages: increased reliability of connections, reduced weight and dimensions of the device, the ability to embed in a complex case.